The Blister Packaging Market in US size is expected to increase by $18.32B from 2021 to 2026, with an accelerated CAGR of 9.19%. as per the latest market report by Technavio. The blister packaging market share growth in the US by the thermoforming segment will be significant for revenue generation.
By adopting high barrier thermoforming, the blister packaging manufacturers can reduce the blister footprint, even in the case of packing big-size capsules or tablets. Thermoforming can reduce the blister footprint by up to 65% more than cold forming technology. Therefore, the waste disposal in thermoforming packaging is lower than cold forming packaging. This will drive the growth of the thermoforming segment during the forecast period.